youngjoon kim
senior engineer
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Professional Email
you****@skhynix.com
Personal Email
****@****.com
Work Phone
(***) ***-***
Mobile
(***) ***-***
semiconductor packaging
fine pitch flipchip bonding
lab technology development
memory flipchip package
2.5d sip pkg development
flipchip interconnection w/ various bump metallurgy
cu bol development w/ advanced si node
epoxy and liquid encapsulant developement
wireless lan packaging
packaging material development
design of experiments
underfill process development
liquid mold development for substrate
Local Location
south korea
Industry
semiconductors, engineering
Designation
senior engineer
Birthday
-
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